Position: This page describes Full custom designed electronic packaging systems and packaging components solutions from Elma and Mistral Solutions.
Elma's modular approach will enable Mistral to offer standard, modified and custom electronic enclosures in a range of markets.
Mistral Solutions has entered into a partnership with Elma Electronic, leading designer and manufacturer of electronics packaging systems.
The company provides standard to fully customised packaging system components such as modular enclosures, cabinets and backplanes.
Elma's modular approach allows fast, cost-effective and proven performance for customised design modifications to standard platforms.
The base products are centred around 19 and 23in Eurocard specifications, with creative design innovations for VME/VME64x, CompactPCI/2.16, VPX, VXI/PXI, AdvancedTCA/MicroTCA and other architectures.
The company's design expertise allows fast implementation of full custom designs for backplanes, subracks, enclosures and cabinets.
These solutions will enable Mistral to offer its customers standard, modified and custom electronic enclosures that house and protect sensitive electronics and electrical packing components in a range of markets, including defence, telecommunications, medical and industrial automation.
"Mistral's prowess in integrating a diverse range of preconfigured components and off-the-shelf products with our custom engineered solutions has helped us emerge as a key embedded solutions provider across varied industry segments".
"Our tie up with Elma, the world-leading brand of enclosure products makes us well positioned to address the electronic packaging and enclosure needs of the Indian embedded packaging systems market", said Ramanan JV, Assistant General Manager - SED, Mistral Solutions.
Component packaging is environmentally friendly
Farnell has launched biodegradable, static dissipative bags that are said to provide an environmentally friendly packaging solution for electronics.
The bags use a material that combines static protection for sensitive components with biodegradability.
The packaging was developed in collaboration with Antistat and is exclusive to Farnell.
It will replace the polythene bags currently used to package an estimated 3.6 million components despatched by Farnell in Europe each year.
With a static charge decay of <0.002s and surface resistivity of <1x1010ohms/sq, the packaging offers the same level of protection as standard ESD packaging but can be disposed of in composting facilities, reducing the impact on the environment.
In addition, a quality packaging controller is enable the packaging equipments work more safely and efficiently.
